cured pdf Datasheet P1 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : MC350 BSCD84H 2409D D100N EL8203 1N410 EL8203 F060298
	Product Description
	Full Text Search

cured Datasheet PDF File

For cured Found Datasheets File :: 477 Search Time::1.406ms
Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PCF1303 PCF1303T
OCR Text	... soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250...
Description	18-element bar graph LCD driver
File Size	59.49K / 10 Page	View it Online	Download Datasheet

				Semtech Corporation
Part No.	LP2951A LP2951ACM
OCR Text	...e output. Generally this can be cured by the addition of 100pF or so from the feedback terminal to the output. 3 (c) 1998 SEMTECH CORP. 652 MITCHELL ROAD NEWBURY PARK CA 91320 150mA ADJUSTABLE VOLTAGE REGULATOR March 17, 1998 LP29...
Description	150mA ADJUSTABLE VOLTAGE REGULATOR
File Size	111.71K / 5 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	PCA1673 PCA1673U PCA1672 PCA1672U PCA1675 PCA1675U PCA1676 PCA1676U/10 PCA1677 PCA1677U
OCR Text	... soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250...
Description	32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
File Size	69.26K / 12 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors
Part No.	CGY2013G CGY2013GC1
OCR Text	... soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250...
Description	GSM 4 W power amplifier
File Size	86.11K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	CGY2030M
OCR Text	... soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250...
Description	DECT 500 mW power amplifier
File Size	93.24K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	CGY2032BTS
OCR Text	... soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Fix the component by first soldering two diagonally-...
Description	DECT 500 mW power amplifier(DECT 500 mW 功率放大
File Size	61.06K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors Philips Semiconductors
Part No.	CGY2032TS
OCR Text	... soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Fix the component by first soldering two diagonally-...
Description	DECT 500 mW power amplifier
File Size	60.20K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	UBA1710M
OCR Text	... soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250...
Description	Modulator for GaAs power amplifiers
File Size	58.92K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	HTRC12002B
OCR Text	... soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering t...
Description	HITAG co-processor
File Size	54.43K / 8 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors
Part No.	SAB6456 SAB6456T
OCR Text	... soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250...
Description	Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:10-13 Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler
File Size	77.51K / 10 Page	View it Online	Download Datasheet

For cured Found Datasheets File :: 477 Search Time::1.406ms
Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |